Teledyne e2v offers high-performance, high-reliability semiconductor solutions, which address the critical functions of the complete signal chain. With a range of products and package solutions, we cater to civil aerospace, industrial, medical, military, scientific and space applications. We also develop customized solutions to meet specific qualifications or environmental requirements.
Position Summary And Responsibilities
- Develop, implement, and maintain processes, process controls, new materials evaluations, and automated equipment used in the packaging and assembly of Hi-Reliability hybrid electronics and advanced packaging
- Support of material review board (MRB) actions on incoming, internally manufactured, and assembly-related non-conforming product.
- Interface with suppliers and customers to resolve material or process related production issues and concerns.
- Support of Internal Design Reviews, Program Readiness Reviews, Design for Manufacturability, New Product Development.
- Be able to communicate complex technical issues both in writing and orally to multiple levels of management as well as to production operators.
- Experience with process start-up, debug, and scale-up manufacturing processes. -Create and maintain process documentation
- Design, document, and assemble tooling and fixtures for die attach and wire bonders and flip chip plus other assembly process /equipment .
- Working in semiconductor package-level microelectronic processes and assembly. Experience with wire bonding, die bonding, flip chip and other assembly process aid in creating test fixtures and procedures .
- Working knowledge of Microsoft Office products, including Word, Excel, and PowerPoint.
- Designs precision tooling assemblies and systems, including production of detail drawings, BOM’s and assembly drawings
- Manufacturing support, working concurrently with Manufacturing Engineers to ensure Design for Manufacture
- Responsibility for all tooling facets of a project from initial concepts through to production/completion determine design in Tooling Capability and targets for production qualification
- Create assembly drawings with step by step instructions for manufacturing assemblies and production release and provide operation personal.
- Bachelor or Master Degree in, Electro Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
- 8+ years of experience developing assembly processes for microelectronic components.
- Experience with die attach, wire bonding, flip chip, under-fill process, encapsulation, hermetic sealing and packaging process solutions is required.
- Preferred Requirements -Hands on assembly equipment programming and troubleshooting experience is preferred.
- Experience applying problem-solving skills, statistical analysis, process control, and DOE design of experiments principles.
- Working knowledge with SolidWorks and/or AutoCAD software preferable
- Experience with electronic materials, including conductive/non-conductive epoxies, solders, Encapsulants, and underfill.
- Experience in selecting, specifying, and qualifying manufacturing equipment.
- Project management experience is preferred.
- Process development experience is highly desired.
- Excellent communication skills. Be able to communicate complex technical issues both in writing and orally to multiple levels of management as well as to production operators.
- Working knowledge of MIL PRF 38534 is preferred.
- Proficiency in MS Project preferred
- US citizenship and fluency in English
- A valid US passport
- Ability to travel to customer sites within the US and internationally (10% of the time)
- An active DoD security clearance, may be required
