Senior Manufacturing Process Engineer


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About the job

Teledyne e2v HiRel offers high-performance, high-reliability semiconductor solutions, which address the critical functions of the complete signal chain. With a range of products and package solutions, we cater to civil aerospace, industrial, medical, military, scientific and space applications.

Teledyne e2v HiRel provides a range of specially qualified versions of many standardized products. We also develop customized solutions to meet specific qualifications or environmental requirements. Teledyne e2v HiRel designs and develops high-speed data converters, microprocessors, memory, analog and logic functions.

The manufacturing engineer is responsible for developing and implementing optimal, cost-effective manufacturing processes and methods in accordance with product specifications and quality standards. Recommends and implements improvements to production processes, methods and controls. Coordinates manufacturing launch for new or revised product. As a part of the operations group the successful candidate will liaise with production personnel, engineering staff and perform sustaining engineering duties within the Operations organization.

Essential Duties And Responsibilities

  • Experience with processing Chip scale packaging, Chip on board, Hybrid assembly and flip chip
  • Hands on project management of new processes & products
  • Cost estimating of existing and new products
  • Continuous improvement of programs
  • Implementation and ongoing Analysis of SPC data
  • Ensuring documentation is clear and accurate
  • Providing inputs to the ERP system, bill-of-materials generation etc.
  • Develop and write procedures for the operation of new equipment or processes
  • Revise existing procedures when specifications or processes are updated
  • BS Degree in Mechanical, Manufacturing or Industrial Engineering
  • 5 plus years of experience in a semiconductor manufacturing environment
  • Experience working in a Continuous Improvement / Operational Excellence / Lean Manufacturing operation
  • Working knowledge of MIL-PRF-38535, MIL-STD-883 test methods and the various J-STD’s related to assembly and testing of high reliability semiconductor devices
  • Basic knowledge of the requirements in MIL-PRF-38534, a plus
  • Concise planning and organizational skills
  • Excellent written and oral communication skills; ability to present to middle management
  • Manage multiple projects effectively while meeting target dates
  • Ability to perform in teamwork situations
  • Sense of urgency and self-motivation; ability to work independently
  • Ability to work under pressure and meet deadlines
  • Attention to detail with strong organizational skills
  • Proficient MS Office Suite (Excel, Word, Powerpoint, etc.)
  • US Citizenship

Due to classified work at the facility and related access restrictions, successful applicants must maintain U.S. Citizenship to allow the person to hold a U.S. Government security clearance.
All qualified applicants will receive consideration for employment without regard to race,color,religion,religious creed,gender,sexual orientation,gender identity,gender expression,transgender,pregnancy,marital status,national origin,ancestry,citizenship status,age,disability,protected Veteran Status,genetics or any other characteristic protected by applicable federal,state,or local law. If you need assistance or an accommodation while seeking employment,please email or call (855)479-1480. Determinations on requests for reasonable accommodation will be made on a case-by-case basis. Please note that only those inquiries concerning a request for reasonable accommodation will receive a response.